Metallization

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Haining Commerce Import & Export Co., Ltd
[China]

Address: No.102, BLDG 4, Sunlake, Huiyu City Garden, Zhenhua Rd., Tongxiang, Zhejiang

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Fibre section pre-cleaned before metallization;
Metallization done below 80 �C deposition temperature
Total metallization thickness: > 1.5 mm
Composition: Ti/Pd/Au with Ti ~ 500 � 100 A, Pd ~ 8000 A, and gold as a top layer of thickness: 2.5 ± 0.1 mm.

Solderability: withstand up to 350 �C and compatible with eutectic temperature of AuSn soldering material
Film adhesion: No blisters, voids, metal peel off should be observed after deposition and after soldering at ~ 320 � 350 �C. Metallization should be compatible with Indium and/or Bismuth based soldering materials.
Hermeticity: should be able to hermetically seal inside the spout to meet Hermeticity = 1 � 10 ^�8 cc of He/second at 1.0 atmosphere differential.
Reliability: should conform to the following Bellcore GR-1221 criteria:

Temperature storage: - 45 �C and 85 �C for 2000 hours
Temperature cycling: - 45 �C to 85 �C for 500 cycles with cycle time of ~ 1 hour
Pull strength: > 160 Mpa
Damp heat: 85 �C/85% RH for 2000 hours.

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